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EMILY BLUNTS
Jan 1, 2005

Powermonkey500
It has a huge temperature improvement because:
1 - Intel used bad thermal paste between the die and the IHS (Integrated heat spreader)
2 - Intel has bad clearance between the die and IHS. Once the glue is removed, the IHS can sit much closer to the die and get better mounting pressure and thermal transfer.

There are two methods - the safe vice and hammer method, or the razorblade method. I would suggest the former.

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EMILY BLUNTS
Jan 1, 2005

the little foam bumpers on athlons so it would sort of self-level
the awful lever clips on p4
when you thought PIII took a lot of pressure to apply the clip and HEY AMD HERE WITH A HOT NEW CPU

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